LABORATORIES

Fabrication labs

The ample portfolio of chemical and physical growth and fabrication methods available make it posible to have access to a wide variety of materials and metastructures of interest. We are experts on materials fabrication through electrochemical processes and high vacuum techniques. Also, we have access to UV and electron lithography facilities, and FIB (MINA).

Electrochemistry lab

Electrodeposition is a versatile and cost-effective technique for fabricating a wide range of two- and three-dimensional materials, such as coatings and films. It is based on electrochemical events involving the reduction or deposition of electroactive and accompanying species on the cathode surface. This technique has been widely utilized to produce thin films for thermoelectric and magnetic applications. Using a template, nanowires can also be manufactured by electrodeposition. In general, electrodeposition can be divided into direct current (DC) and pulse electrodeposition. DC electrodeposition is likely to produce a dendritic structure and an inhomogeneous surface in thin films. Pulse electrodeposition is a viable solution. During the off (resting) period, there is enough time for ion diffusion on the electrode surface and crystal formation on the alloy surface.

Anodization is essential for finishing elements made from aluminum and other metals. In our lab we used the anodization of different metals to generate new templates that allow us to nanostructure semiconducting and metallic materials to explore the novel properties that appears at the nanoscale.

Sputtering and Thermal Evaporation lab

Two deposition systems with a base pressure in the 10-10 mbar for the physical deposition by MBE and sputtering of a wide variety of materials.

Hybrid MBE/sputtering system with 3 effusion cells, e-beam evaporator with 3 crucibles, 6 DC/RF UHV compatible sputtering magnetrons. The sample holder is capable of translational, polar and azimuthal movements, allowing for multiaxial control of the geometrical deposition conditions with substrate temperatures ranging between RT and 600ºC. A smaller UHV deposition system is also capable of simultaneously performing evaporation and sputtering. Polar and translational movements in the sample holder, with temperature ranges between RT and 300ºC. Both systems with load lock for fast entry of substrates without breaking the vacuum.

Design and Construction of EUROPHAS (under the project POWERbyU). EUROPHAS is a completely novel and unique semi-industrial tool, to account for higher deposition areas required for the fabrication of the devices for energy applications.

Porous alumina template fabrication

The anodic aluminum oxide (AAO) membranes are alumina membranes grown by an electrochemical method, known as anodization, which induces the formation of aluminum oxide on an aluminum surface and under certain conditions pores that self-ordered.

Thermal treatments

The MILA-5000 series can perform high speed heating and cooling. This oven is based on a near-infrared lamp for a precise temperature control.

Ultra-high-vacuum deposition systems

Two deposition systems with a base pressure in the 10^-10 mbar for the physical deposition by MBE and sputtering of a wide variety of materials.

Metal evaporator

Evaporation system for the deposition of thin films of Ti, Au, etc.

Fabrication labs

ELECTROCHEMISTRY LAB

SPUTTERING AND THERMAL EVAPORATION LAB

Electric Characterization Lab

HALL MEASUREMENTS

THERMOELECTRIC POWER FACTOR MEASUREMENT

Thermal Characterization Lab

PHOTOACOUSTIC TECHNIQUE

LFA 1000 HIGH PERFORMANCE LASER FLASH MEASUREMENTS

3Ω-SCANNING THERMAL MICROSCOPY (STHM)

Triboelectric Characterization Lab

WORK ON PROGRESS

Optical Characterization Lab

MICRO RAMAN

INFRARED SPECTROSCOPY

FTIR

UV-VIS SPECTROPHOTOMETER

Magnetic Chatacterization Lab

FTIR SPECTROMETER WITH IR MICROSCOPE AND ATR OBJECTIVE

PHOTOCURRENT/PHOTOVOLTAGE MEASUREMENTS

TRANSVERSE LONGITUDINAL KERR

Others

AFM

DENSITY MEASUREMENT

3D PRINTER

POSTPROCESSING